%A NIM. 10620011 KUKUH SUBEKTI
%O Pembimbing :  Retno Rahmawati, M.Si
%T METODE ELEKTROPLATING PADA SUBTRAT
TEMBAGA (Cu) DENGAN PELAPIS PERAK (Ag)
UNTUK MENINGKATKAN KEINDAHAN
DEKORATIF DAN KETAHANAN KOROSI LOGAM
%X Metal craft currently is growing rapidly particularly copper craft.
Nevertheless, craft is easily corroded. The corroded crafts leads to the decrase of
the selling price. Coating of silver (Ag) using electroplating method (electric
layers) is one way to protect the substrate copper (Cu) from metal corrosion. The
coated copper is decoratively more beautiful. This study has several purposes
including to obtain good results yamg coating. Knowing the value of the metal
corrosion rate as a function of time and voltage function. Electroplating
parameters used include the plating time of 600, 900, 1200, 1500 and 1800
seconds. Other parameter is the power supply voltage of 12, 15, 18, 21, and 24 V.
Corrosion resistance testing is done by soaking the substrate copper (Cu) in 10%
HCl solution for 24 hours. Elekroplating process steps being taken to obtain good
results, ie cutting the copper plate butting- degreasing- rinsing- pickling- rinsingsilver
plating- rinsing- drying. From the research, it turns out the longer the
coating process, the value of the corrosion rate decreases and decorative with a
small voltage.The results of micro photo with the light microscope using a
magnification of 100x shows that the layer of silver (Ag) can protect a substrate
formed of copper (Cu) of metal corrosion.
%K Keywords: Electroplating, Copper (Cu), silver (Ag), Corrosion of Metals
%D 2015
%I UIN SUNAN KALIJAGA YOGYAKARTA
%L digilib15704